A21SP16 datasheet(35/37 Pages) STMICROELECTRONICS

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A21SP16

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 67. Pin-out for 9-bump flip-chip (top view)

Figure 68. Marking for 9-bump flip-chip (top view)

Figure 69. Mechanical data for 9-bump flip-chip

1/A1

7/C1

8/C2

9/C3

4/B1

6/B3

2/A2

3/A3

5/B2

GND

STBY

GND

OUT

1/A1

7/C1

8/C2

9/C3

4/B1

6/B3

2/A2

3/A3

5/B2

GND

STBY

GND

OUT

 Bumps are underneath

 Bump diameter = 300m

 ST Logo

 Symbol for lead-free: E

 Two first XX product code: W2

 third X: Assembly code

 Three digits date code: Y for year - WW for week

 The dot is for marking pin A1

XXX

YWW

XXX

YWW



Die size: 1.6 mm x 1.6 mm ±30

m



Die height (including bumps): 600

m



Bump diameter: 315

m 50 m



Bump diameter before reflow: 300

m 10 m



Bump height: 250

m ±40 m



Die height: 350

m ±20 m



Pitch: 500

m 50 m



Coplanarity: 50

m max

1.60 mm

0.5mm

 0.25mm

1.60 mm

0.5mm

 0.25mm

600µm

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