TSL13FN – 12

ams Datasheet: 2014-Jun-04 [1-00]

S o ldering & St or age I n f o r m ation

Soldering Information

The reflow profile specified here describes expected maximum

heat exposure of devices during the solder reflow process of

the device on a PCB. Temperature is measured at the top of the

device. Devices should be limited to one pass through solder

reflow profile.

Figure 19:

Solder Reflow Profile

Figure 20:

Solder Reflow Graph

Note: Not to scale – for reference only.

Symbol

Parameter

TSL13FN

Average temperature gradient in preheating

2.5°C/sec

Soak time

2 to 3 minutes

Max 60 sec

Max 50 sec

Max 10 sec

Peak temperature in reflow

260°C(-0°C/+5°C)

Temperature gradient in cooling

Max -5°C/sec

Soldering & Storage

Information

TSL13FN_Datasheet, Rev.: 1.0, TSL13FN_Datasheet_[1-00]_Light-To-Voltage Converters

Release Date: 2014-06-17, Key Contact: Matt Kroese