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M950X0-W датащи(PDF) 42 Page - STMicroelectronics

номер детали M950X0-W
подробное описание детали  Compatible with SPI bus serial interface
PDF  46 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M950X0-W датащи(HTML) 42 Page - STMicroelectronics

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Package mechanical data
M950x0-W M950x0-R M950x0-DF
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DocID6512 Rev 13
Figure 24. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, outline
1. Drawing is not to scale.
2. The central pad (area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be allowed
to be connected to any other voltage or signal line on the PCB, for example during the soldering process.
3. The circle in the top view of the package indicates the position of pin 1.
Table 24. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, data
Symbol
Millimeters
Inches(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ.
Min.
Max.
Typ.
Min.
Max.
A
0.550
0.450
0.600
0.0217
0.0177
0.0236
A1
0.020
0.000
0.050
0.0008
0.0000
0.0020
b
0.250
0.200
0.300
0.0098
0.0079
0.0118
D
2.000
1.900
2.100
0.0787
0.0748
0.0827
D2 (rev MC)
-
1.200
1.600
-
0.0472
0.0630
E
3.000
2.900
3.100
0.1181
0.1142
0.1220
E2 (rev MC)
-
1.200
1.600
-
0.0472
0.0630
e
0.500
-
-
0.0197
-
-
K (rev MC)
-
0.300
-
-
0.0118
-
L
-
0.300
0.500
-
0.0118
0.0197
L1
-
-
0.150
-
-
0.0059
L3
-
0.300
-
-
0.0118
-
eee(2)
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
-
0.080
-
-
0.0031
-



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