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ICS8745BI датащи(PDF) 14 Page - Integrated Device Technology |
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ICS8745BI датащи(HTML) 14 Page - Integrated Device Technology |
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14 / 20 page ![]() ICS8745BYI REVISION D JUNE 11, 2009 14 ©2009 Integrated Device Technology, Inc. ICS8745BI Data Sheet 1:5 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR The following component footprints are used in this layout example. All the resistors and capacitors are size 0603. Power and Grounding Place the decoupling capacitors as close as possible to the power pins. If space allows, placement of the decoupling capacitor on the component side is preferred. This can reduce unwanted inductance between the decoupling capacitor and the power pin caused by the via. Maximize the power and ground pad sizes and number of vias capacitors. This can reduce the inductance between the power and ground planes and the component power and ground pins. The RC filter consisting of R7, C11, and C16 should be placed as close to the VDDA pin as possible. Clock Traces and Termination Poor signal integrity can degrade the system performance or cause system failure. In synchronous high-speed digital systems, the clock signal is less tolerant to poor signal integrity than other signals. Any ringing on the rising or falling edge or excessive ring back can cause system failure. The shape of the trace and the trace delay might be restricted by the available space on the board and the component location. While routing the traces, the clock signal traces should be routed first and should be locked prior to routing other signal traces. • The differential 50 Ω output traces should have the same length. • Avoid sharp angles on the clock trace. Sharp angle turns cause the characteristic impedance to change on the transmission lines. • Keep the clock traces on the same layer. Whenever possible, avoid placing vias on the clock traces. Placement of vias on the traces can affect the trace characteristic impedance and hence degrade signal integrity. • To prevent cross talk, avoid routing other signal traces in parallel with the clock traces. If running parallel traces is unavoidable, allow a separation of at least three trace widths between the differential clock trace and the other signal trace. • Make sure no other signal traces are routed between the clock trace pair. • The matching termination resistors should be located as close to the receiver input pins as possible. Figure 5B. PCB Board Layout for ICS8745BI C16 GND U1 C5 50 Ohm Traces C2 VDDA VDDO VIA Pin 1 C4 R7 C11 VDD C6 C1 |
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