TPS62050, TPS62051, TPS62052, TPS62054, TPS62056

SLVS432F – SEPTEMBER 2002 – REVISED JUNE 2015

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8 Specifications

8.1 Absolute Maximum Ratings

Over operating free-air temperature range unless otherwise noted

(1)

MIN

MAX

UNIT

Supply voltage

–0.3

11

V

Voltage at EN, SYNC

–0.3

V

Voltage at LBI, FB, LBO, PG

–0.3

7

V

Voltage at SW

–0.3

V

Output current

850

mA

Maximum junction temperature

150

°C

Operating free-air temperature

–40

85

°C

Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds

300

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The voltage at the SW pin is sampled in PFM mode 15 µs after the PMOS has switched off. During this time the voltage at SW is limited

to 7 V maximum. Therefore, the output voltage of the converter is limited to 7 V maximum.

8.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

2.7

10

V

Voltage at PG, LBO

6

V

Maximum output current

mA

Operating junction temperature

–40

125

°C

(1)

Assuming no thermal limitation

8.4 Thermal Information

TPS6205x

DGS (VSSOP)

UNIT

10 PINS

Junction-to-ambient thermal resistance

154

°C/W

Junction-to-case (top) thermal resistance

50.6

°C/W

Junction-to-board thermal resistance

73.6

°C/W

Junction-to-top characterization parameter

5.1

°C/W

Junction-to-board characterization parameter

72.4

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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