STM32F779IGH7 datasheet(173/255 Pages) STMICROELECTRONICS

номер детали	STM32F779IGH7

подробное описание детали	Dual mode Quad-SPI

PDF	255 Pages

Scroll/Zoom	100%

производитель	STMICROELECTRONICS [STMicroelectronics]

домашняя страница	http://www.st.com

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173 / 255 page

DocID028294 Rev 4

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STM32F777xx STM32F778Ax STM32F779xx

Electrical characteristics

224

Figure 41. ADC accuracy characteristics

1. See also Table 73.

2. Example of an actual transfer curve.

3. Ideal transfer curve.

4. End point correlation line.

5. ET = Total Unadjusted Error: maximum deviation between the actual and the ideal transfer curves.

EO = Offset Error: deviation between the first actual transition and the first ideal one.

EG = Gain Error: deviation between the last ideal transition and the last actual one.

ED = Differential Linearity Error: maximum deviation between actual steps and the ideal one.

EL = Integral Linearity Error: maximum deviation between any actual transition and the end point

correlation line.

Figure 42. Typical connection diagram using the ADC

1. Refer to Table 71 for the values of RAIN, RADC and CADC.

2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the

pad capacitance (roughly 5 pF). A high Cparasitic value downgrades conversion accuracy. To remedy this,

fADC should be reduced.

STM32F779IGH7 датащи(PDF) 173 Page - STMicroelectronics