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STM32L443CC датащи(PDF) 191 Page - STMicroelectronics

номер детали STM32L443CC
подробное описание детали  Batch acquisition mode
PDF  207 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STM32L443CC датащи(HTML) 191 Page - STMicroelectronics

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STM32L443CC STM32L443RC STM32L443VC
Package information
204
Figure 54. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale
package recommended footprint
b(3)
0.190
0.220
0.250
0.0075
0.0087
0.0098
D
3.106
3.141
3.176
0.1223
0.1237
0.1250
E
3.092
3.127
3.162
0.1217
0.1231
0.1245
e
-
0.350
-
-
0.0138
-
e1
-
2.450
-
-
0.0965
-
e2
-
2.450
-
-
0.0965
-
F
-
0.3455
-
-
0.0136
-
G
-
0.3385
-
-
0.0133
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Table 97. WLCSP64 recommended PCB design rules (0.35 mm pitch)
Dimension
Recommended values
Pitch
0.35 mm
Dpad
0.210 mm
Dsm
0.275 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.235 mm
Stencil thickness
0.100 mm
Table 96. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max



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