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STM32L443CC датащи(PDF) 188 Page - STMicroelectronics |
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STM32L443CC датащи(HTML) 188 Page - STMicroelectronics |
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188 / 207 page ![]() Package information STM32L443CC STM32L443RC STM32L443VC 188/207 DocID028739 Rev 2 Figure 51. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array package recommended footprint Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. F 0.700 0.750 0.800 0.0276 0.0295 0.0315 ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 94. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 Table 95. UFBGA64 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm |
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