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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32F100RC датащи(PDF) 86 Page - STMicroelectronics |
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STM32F100RC датащи(HTML) 86 Page - STMicroelectronics |
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86 / 106 page  Electrical characteristics STM32F100xC, STM32F100xD, STM32F100xE 86/106 DocID15081 Rev 10 Note: Any positive injection current within the limits specified for IINJ(PIN) and ΣIINJ(PIN) in Section 5.3.13 does not affect the ADC accuracy. Figure 33. ADC accuracy characteristics Figure 34. Typical connection diagram using the ADC 1. Refer to Table 51 for the values of RAIN, RADC and CADC. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy this, fADC should be reduced. General PCB design guidelines Power supply decoupling should be performed as shown in Figure 35 or Figure 36, depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be ceramic (good quality). They should be placed them as close as possible to the chip. |
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