STM8L151X8 datasheet(8/146 Pages) STMICROELECTRONICS

8 / 146 page

List of figures

STM8L151x6/8 STM8L152x6/8

8/146

DocID17943 Rev 10

Figure 48.

LQFP80 - 80-pin, 14 x 14 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . 124

Figure 49.

LQFP80 - 80-pin, 14 x 14 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

Figure 50.

LQFP80 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

Figure 51.

LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . 128

Figure 52.

LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

Figure 53.

LQFP64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

Figure 54.

LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 131

Figure 55.

LQFP48 - 48-pin, 7 x 7 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

Figure 56.

LQFP48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

Figure 57.

UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

Figure 58.

UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

Figure 59.

UFQFPN48 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

Figure 60.

WLCSP32 - 32-ball, 1.913 x 3.329 mm, 0.4 mm pitch wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

Figure 61.

WLCSP32 - 32-ball, 1.913 x 3.329 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

STM8L151x8 датащи(PDF) 8 Page - STMicroelectronics