ST10F296 datasheet(342/346 Pages) STMICROELECTRONICS

номер детали	ST10F296

подробное описание детали	High performance 16-bit CPU with DSP functions

PDF	346 Pages

Scroll/Zoom	100%

производитель	STMICROELECTRONICS [STMicroelectronics]

домашняя страница	http://www.st.com

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342 / 346 page

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Package mechanical data

ST10F296E

342/346

Package mechanical data

To meet environmental requirements, ST offers the device in ECOPACK® packages. These

packages have a lead-free second level interconnect. The category of second level

interconnect is marked on the package and on the inner box label, in compliance with

JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK® specifications are available at www.st.com..

Figure 121. PBGA 208 (23 x 23 x 1.96 mm) outline

PBGA stands for plastic ball grid array.

The terminal A1 corner of the package must be identified on the top surface by using a corner chamfer, ink

or metallized marking, identation or other feature of the package body or an integral heastslug. A

distinguishing feature is also allowable on the bottom of the package to identify the terminal A1 corner. The

exact shape and size of this feature is optional.

φ b (208 + 25 balls)

10 11 12 13 14 15 16 17

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12 3

A1 ball pad corner 2

Seating

plane

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ST10F296 датащи(PDF) 342 Page - STMicroelectronics