LNBP8L - LNBP9L - LNBP10L - LNBP11L

Detailed description and application hints

11/21

6.2

Single supply for the DFN package

same power source without affecting the performance of other circuits, at the cost of higher

power losses in the device and higher heat sink surface. Also, in order to reduce the power

dissipation in the device, an appropriate-value resistor can be inserted in series with the

Power dissipated in this resistor is:

6.3

IPPAK mounting and thermal considerations

First, it should be noted that the tab is directly connected to the GND pin, so care must be

taken when the device is connected to a heat-sink. If the heat sink is at a different voltage

than the ground, an electrical insulator must be added between the tab and the heat sink at

the cost of an increase in the thermal resistance. For better thermal performance, an

isolated heat sink or connection to ground is recommended.

12

Ω

≅

-

-

≤

10

x

500

16)

(23

-3

f

V

R

12

Ω

≅

-

-

≤

10

x

500

16)

(23

-3

f

V

R

()

I

OUT

R

P

D

3 W

10

*

500

*

12

*

2

3

2

=

=

=

-

()

I

OUT

R

P

D

3 W

10

*

500

*

12

*

2

3

2

=

=

=

-