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A5974D датащи(PDF) 24 Page - STMicroelectronics |
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A5974D датащи(HTML) 24 Page - STMicroelectronics |
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24 / 46 page ![]() Application information A5974D 24/46 DocID018774 Rev 2 Figure 13. Layout example 8.3 Thermal considerations 8.3.1 Thermal resistance RthJA RthJ-A is the equivalent static thermal resistance junction to ambient of the device; it can be calculated as the parallel of many paths of heat conduction from the junction to the ambient. For this device the path through the exposed pad is the one conducting the largest amount of heat. The static RthJA measured on the application is about 40 °C/W. The junction temperature of the device will be: Equation 22 The dissipated power of the device is tied to three different sources: Conduction losses due to the not insignificant RDSON, which are equal to: Equation 23 Where D is the duty cycle of the application. Note that the duty cycle is theoretically given by the ratio between VOUT and VIN, but in practice it is substantially higher than this value to compensate for the losses in the overall application. For this reason, the switching losses related to the RDSON increase compared to an ideal case. TJ TA RthJA – PTOT + = PON RDSON IOUT 2 D = |
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