STTH20LCD06C

Characteristics

Doc ID 15898 Rev 2

5/10

Figure 13.

Thermal resistance junction to ambient versus copper surface under tab

Figure 11.

(typical values, per diode)

Figure 12.

Junction capacitance versus

reverse voltage applied

(typical values, per diode)

0

20

40

60

80

100

120

140

160

180

200

0

50

100

150

200

250

300

350

400

450

500

tFR (ns)

IF = IF(AV)

VR = 1.1 x VFmax.

Tj = 125 °C

dIF/dt (A/µs)

1

10

100

1

10

100

1000

C (pF)

F = 1 MHz

VOSC = 30 mVRMS

Tj = 25 °C

VR (V)

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

Rth(j-a)(°C/W)

Scu(cm²)

D2PAK

Epoxy printed board Fr4, copper thickness: 35 µm