Device description

STSPIN250

20/26

DocID029872 Rev 2

6.5

Thermal shutdown

The device embeds circuitry protecting it from the overtemperature condition.

When the thermal shutdown temperature is reached the power stage is disabled and the

EN\FAULT input is forced low through the integrated open-drain MOSFET.

The protection and the EN\FAULT output are released when the IC temperature returns

Figure 11. Thermal shutdown management