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PA03 датащи(PDF) 1 Page - Cirrus Logic |
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PA03 датащи(HTML) 1 Page - Cirrus Logic |
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1 / 5 page ![]() APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com 1 FEATURES • MO-127 COPPER POWER DIP™ PACKAGE • HIGH INTERNAL POWER DISSIPATION — 500 watts • HIGH VOLTAGE OPERATION — ±75V • VERY HIGH CURRENT — ±30 amps • INTERNAL SOA PROTECTION • OUTPUT SWINGS CLOSE TO SUPPLY RAILS • EXTERNAL SHUTDOWN CONTROL APPLICATIONS • LINEAR AND ROTARY MOTOR DRIVES • YOKE/MAGNETIC FIELD DEFLECTION • PROGRAMMABLE POWER SUPPLIES to ±68V • TRANSDUCER/AUDIO TO 1000W DESCRIPTION The super power PA03 advances the state of the art in both brute force power and self protection against abnormal operating conditions. Its features start with a copper dip pack- age developed by Apex to extend power capabilities well beyond those attainable with the familiar TO-3 package. The increased pin count of the new package provides additional control features, while the superior thermal conductivity of copper allows substantially higher power ratings. The PA03 incorporates innovative current limiting circuits limiting internal power dissipation to a curve approximating the safe operating area of the power transistors. The internal current limit of 35A is supplemented with thermal sensing which reduces the current limit as the substrate temperature rises. Furthermore, a subcircuit monitors actual junction temperatures and with a response time of less than ten mil- liseconds reduces the current limit further to keep the junction temperature at 175°C. The PA03 also features a laser trimmed high performance FET input stage providing superior DC accuracies both initially and over the full temperature range. EQUIVALENT SCHEMATIC � � � � � �� �� � � � � �� �� � � ��� ��� �� ��� ��� ��� ��� �� �� �� ��� ��� ��� ����� ������ ����� ������ ��� ��� ���� ��� �� �� �� �� ��� ��� ��� ��� ��� ��� �� ��� �� �� ��� �� �� � � ��� The PA03 output power stages contain fast reverse recovery diodes for sustained high energy flyback protection. This hybrid integrated circuit utilizes thick film resistors, ceramic capacitors and silicon semiconductors to maximize reliability, minimize size and give top performance. Ultra- sonically bonded aluminum wires provide reliable intercon- nections at all operating temperatures. The MO-127 Copper, 12-pin Power Dip™ package (see Package Outlines), is hermetically sealed and isolated from the internal circuits. Insulating washers are not recommended. IMPORTANT: Observe mounting precautions. TYPICAL APPLICATION �������� �������� ������ ���� ��������� ��� � �� �� � ��� �� �� ���� ��� ����� �� ���� ������� �������� ��� �������������������������������������������������������������� � � � � � � � � � � � � � � � ���������������������������� ������������ 12-PIN DIP PACKAGE STYLE CU |
Аналогичный номер детали - PA03 |
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Аналогичное описание - PA03 |
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