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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LPS225HB датащи(PDF) 21 Page - STMicroelectronics |
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LPS225HB датащи(HTML) 21 Page - STMicroelectronics |
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21 / 47 page  DocID030115 Rev 2 21/47 LPS225HB Application hints 47 5 Application hints Figure 12. LPS225HB electrical connections The device core is supplied through the VDD line. Power supply decoupling capacitors (100 nF, 4.7 μF) should be placed as near as possible to the supply pad of the device (common design practice). The functionality of the device and the measured data outputs are selectable and accessible through the I²C/SPI interface. When using the I²C, CS must be tied high (i.e. connected to VDD_IO). 5.1 Soldering information The HLGA package is compliant with the ECOPACK® standard and it is qualified for soldering heat resistance according to JEDEC J-STD-020. |
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