SPC56AP54X datasheet(57/105 Pages) STMICROELECTRONICS

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DocID18340 Rev 6

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SPC56xP54x, SPC56xP60x

Electrical characteristics

104

RJC is device related and cannot be influenced by the user. The user controls the thermal

environment to change the case to ambient thermal resistance, RCA. For instance, the user

can change the size of the heat sink, the air flow around the device, the interface material,

the mounting arrangement on printed circuit board, or change the thermal dissipation on the

printed circuit board surrounding the device.

To determine the junction temperature of the device in the application when heat sinks are

not used, the Thermal Characterization Parameter (

JT) can be used to determine the

junction temperature with a measurement of the temperature at the top center of the

package case using Equation 3:

Equation 3 TJ = TT + (JT × PD)

where:

TT= thermocouple temperature on top of the package (°C)

JT= thermal characterization parameter (°C/W)

PD= power dissipation in the package (W)

The thermal characterization parameter is measured per JESD51-2 specification using a 40

gauge type T thermocouple epoxied to the top center of the package case. The

thermocouple should be positioned so that the thermocouple junction rests on the package.

A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of

wire extending from the junction. The thermocouple wire is placed flat against the package

case to avoid measurement errors caused by cooling effects of the thermocouple wire.

3.5.1.1

References

Semiconductor Equipment and Materials International



3081 Zanker Road



San Jose, CA 95134 U.S.A.



(408) 943-6900

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering

Documents at 800-854-7179 or 303-397-7956.

JEDEC specifications are available on the WEB at jedec.org web site.

1. C.E. Triplett and B. Joiner, An Experimental Characterization of a 272 PBGA Within an

Automotive Engine Controller Module, Proceedings of SemiTherm, San Diego, 1998, pp.

47-54.

2. G. Kromann, S. Shidore, and S. Addison, Thermal Modeling of a PBGA for Air-Cooled

Applications, Electronic Packaging and Production, pp. 53-58, March 1998.

3. B. Joiner and V. Adams, Measurement and Simulation of Junction to Board Thermal

Resistance and Its Application in Thermal Modeling, Proceedings of SemiTherm, San

Diego, 1999, pp. 212-220.

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