2000 Dec 04

4

Philips Semiconductors

Product specification

1900 MHz high linear low noise amplifier

BGA2012

APPLICATION INFORMATION

List of components (see Fig.2)

Note

1. The stripline (w = 0.7 mm) is on a gold plated double copper-clad printed-circuit board (

ε

board thickness = 0.64 mm, copper thickness = 35

µm, gold thickness = 5 µm.

COMPONENT

DESCRIPTION

TYPICAL

APPLICATION

HIGH IP3

APPLICATION

DIMENSIONS

C1, C2

multilayer ceramic chip capacitor

100 pF

100 pF

0603

C3, C5

multilayer ceramic chip capacitor

22 nF

22 nF

0603

C4

multilayer ceramic chip capacitor

−−−

C6

multilayer ceramic chip capacitor

−

100 nF

0805

L1

SMD inductor

−

3.9 nH

0603

L2

SMD inductor

−

3.9 nH

0603

handbook, full pagewidth

GND

OUT

stripline

BIAS

CIRCUIT

C1

C6

L1

VC

L2

RF in

VS

VC

IN

C4

SOT363

C5

C2

RF out

C3

VS

MLD470

Fig.2 Application circuit.