NOTES: UNLESS OTHERWISE SPECIFIED

1. EPOXY COATING

2. 63Sn/37Pb EUTECTIC BUMP

3. RECOMMENDED NON-SOLDER MASK DEFINED LANDING PAD.

4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE

NUMBERED COUNTERCLOCKWISE.

5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACK-

AGE LENGTH AND X3 IS PACKAGE HEIGHT.

6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.

micro SMD Package

Order Package Number LMC8101BP or LMC8101BPX

NS Package Number BPA08EFB

X

X

X

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