TM

Suffix ThickneSS

(prior To Tinning)

flaTneSS &

paralleliSM

hoT

face

cold

face

lead

length

Ta

0.131”± 0.001”

0.001” / 0.001”

Lapped

Lapped

6.0”

TB

0.131”± 0.0005”

0.0005” / 0.0005” Lapped

Lapped

6.0”

Suffix SealanT color TeMp range deScripTion

r

RTV

White

-60 to 204 °C

Non-corrosive, silicone adhesive sealant

e

Epoxy

Black

-55 to 150 °C

Low density syntactic foam epoxy encapsulant

Innovative Technology

for a Connected World

Thermoelectric Modules

Americas: +1 888.246.9050

Europe: +46.31.420530

Asia: +86.755.2714.1166

clv.customerpos@lairdtech.com

www.lairdtech.com

FEaTurES

• StrongLeadAttachment

• PreciseTemperatureControl

• ReliableSolidStateOperation

• NoSoundorVibration

• DCOperation

• RoHSCompliant

aPPliCaTionS

• AnalyticalInstrumentation

• PhotonicsLaserSystems

• ElectronicEnclosureCooling

• FoodandBeverageCooling

• Chillers(LiquidCooling)

• ConsumerAppliances

sideoftheceramichasanextendededgethatallowsstrongleadattachment

toaccommodatethewiringofmultipleTEMsintoanarray.

Thisproductlineisavailablein4,6,and8Ampconfigurationsandisidealforhigh-

volumeproduction.AssembledwithBismuthTelluridesemiconductormaterial

designedforhighercurrentandlargerheat-pumpingapplications.

perforMance SpecificaTionS

hot Side Temperature (°c)

25°C

50°C

Qmax (Watts)

73.9

83.4

delta Tmax (°c)

64

75

imax (amps)

8.5

8.7

Vmax (Volts)

14.3

16.2

Module resistance (ohms)

1.55

1.75

SEaling oPTion