Data Sheet

AD8661/AD8662/AD8664

Rev. E | Page 13 of 16

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-A A

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

4

1

8

5

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2440)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

Figure 34. 8-Lead Small Outline Package [SOIC_N]

Narrow Body

(R-8)

Dimensions shown in millimeters and (inches)

8

1

5

4

0.30

0.25

0.20

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.55

1.45

1.35

1.84

1.74

1.64

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED-4

PIN 1

INDICATOR

(R 0.15)

TOP VIEW

BOTTOM VIEW

SIDE VIEW

Figure 35. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-13)

Dimensions shown in millimeters