LMV115 datasheet(3/13 Pages) NSC

3 / 13 page

2.8V Electrical Characteristics (Continued)

Unless otherwise specified, all limits guaranteed for T

J = 25˚C, V

+ = 2.8V, V− = 0V, V

CM =V

+/2, shutdown = 0.0V, and R

L =

50k

Ω to V+/2, C

L = 5pF to V

+/2 and C

COUPLING = 1nF.Boldface limits apply at the temperature extremes.

Symbol

Parameter

Conditions

Min

(Note 9)

Typ

(Note 8)

Max

(Note 9)

Units

Input Impedance

f = 25MHz; Shutdown = 2.8V

2.38

Ω

f = 25MHz; Shutdown = 0V

2.47

Output Swing Positive

L = 50k

Ω to V+/2

1.90

1.65

2.16

Output Swing Negative

L = 50k

Ω to V+/2

1.05

1.35

1.30

Linear Output Current

No Load; V

OUT =V

+ − 1.1V

(Sourcing)

−90

−35

−206

µA

No Load; V

OUT =V

− + 1.1V

(Sinking)

100

205

Output Short-Circuit Current

(Note 5)

No Load; Sourcing to V

+/2

−90

−35

−186

µA

No Load; Sinking from V

+/2

100

191

Switch in ON Position

Ω

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.

Note 2: Human Body Model (HBM) is 1.5k

Ω in series with 100pF.

Note 3: Machine Model, 0

Ω in series with 200pF.

Note 4: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the

maximum allowed junction temperature of 150˚C

Note 5: Infinite Duration; Short circuit test is a momentary test. See next note.

Note 6: The maximum power dissipation is a function of TJ(MAX), θJA , and TA. The maximum allowable power dissipation at any ambient temperature is

PD =(TJ(MAX) -TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.

Note 7: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of

the device such that TJ =TA . There is no guarantee of parametric performance as indicated in the electrical tables under conditions of internal self-heating where

TJ > TA. See Applications section for information on temperature de-rating of this device.

Note 8: Typical Values represent the most likely parametric norm.

Note 9: All limits are guaranteed by testing or statistical analysis.

Note 10: Positive current corresponds to current flowing into the device.

Note 11: Slew rate is the average of the positive and negative slew rate.

Note 12: Average Temperature Coefficient is determined by dividing the change in a parameter at temperature extremes by the total temperature change.

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