LM6181AMJSLASH883 datasheet(5/23 Pages) NSC

5 / 23 page

±5V AC Electrical Characteristics

The following specifications apply for Supply Voltage = ±5V, R

F = 820Ω, and RL = 1kΩ unless otherwise noted. Boldface

limits apply at the temperature extremes; all other limits T

J = 25˚C.

Symbol

Parameter

Conditions

LM6181AM

LM6181AI

LM6181I

Units

Typical

Limit

Typical

Limit

Typical

Limit

(Note 4)

(Note 5)

(Note 4)

(Note 5)

(Note 4)

(Note 5)

Closed Loop Bandwidth −3 dB

AV = +2

MHz

min

AV = +10

AV = −1

AV = −10

PBW

Power Bandwidth

AV = −1, VO = 4VPP

Slew Rate

AV = −1, VO = ±2V,

500

375

500

375

500

375

V/µs

RL = 150Ω (Note 6)

min

Settling Time (0.1%)AV = −1, VO = ±2V

RL = 150Ω

tr,tf

Rise and Fall Time

VO = 1VPP

8.5

Propagation Delay Time

VO = 1VPP

in(+)

Non-Inverting Input Noise

f = 1 kHz

Current Density

in(−)

Inverting Input Noise

f = 1 kHz

Current Density

Input Noise Voltage

Density

f = 1 kHz

Second Harmonic Distortion

2 VPP, 10 MHz

−45

dBc

Third Harmonic Distortion

2 VPP, 10 MHz

−55

Differential Gain

RL = 150Ω

AV = +2

0.063

NTSC

Differential Phase

RL = 150Ω

AV = +2

0.16

Deg

NTSC

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions the device is intended to

be functional, but device parameter specifications may not be guaranteed under these conditions. For guaranteed specifications and test conditions, see the Electrical

Characteristics.

Note 2: Human body model 100 pF and 1.5 k

Ω.

Note 3: The typical junction-to-ambient thermal resistance of the molded plastic DIP(N) package soldered directly into a PC board is 102˚C/W. The

junction-to-ambient thermal resistance of the S.O. surface mount (M) package mounted flush to the PC board is 70˚C/W when pins 1, 4, 8, 9 and 16 are soldered

to a total 2 in2 1 oz. copper trace. The 16-pin S.O. (M) package must have pin 4 and at least one of pins 1, 8, 9, or 16 connected to V− for proper operation. The typical

junction-to-ambient thermal resistance of the S.O. (M-8) package soldered directly into a PC board is 153˚C/W.

Note 4: Typical values represent the most likely parametric norm.

Note 5: All limits guaranteed at room temperature (standard type face) or at operating temperature extremes (bold face type).

Note 6: Measured from +25% to +75% of output waveform.

Note 7: Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C. Output cur-

rents in excess of ±130 mA over a long term basis may adversely affect reliability.

Note 8: For guaranteed Military Temperature Range parameters see RETS6181X.

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