Ver: 1.4

Jul 31, 2001

TEL: 886-3-5788833

http://www.gmt.com.tw

2

G960

Global Mixed-mode Technology Inc.

Absolute Maximum Ratings

(Note 1)

Input Voltage……………………………………..……10V

Power Dissipation Internally Limited

(Note

2)

Maximum Junction Temperature…..………………...150°C

Storage Temperature Range……...-65°C

≤ T

J

≤+150°C

Lead Temperature, Time for Wave Soldering

TO-220 Package……………………………...260°C, 10s

TO-252 Package……………………………….260°C, 4s

SOT-223 Package……………………………..260°C, 4s

Operating Conditions

(Note 1)

Input Voltage……………………………………….4V~7V

Temperature Range…………………-40°C

≤ T

J

≤125°C

Electrical Characteristics

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Output Voltage

3.234

3.3

3.366

V

Line Regulation

20

50

mV

Load Regulation

30

80

mV

Output Impedance

100mA DC and 20mA AC, fo = 120Hz

100

m

Ω

Quiescent Current

0.6

mA

Ripple Rejection

42

dB

0.8

V

Dropout Voltage

200

mV

Short Circuit Current

1.6

1.9

A

Over Temperature

125

°C

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating

Conditions are conditions under which the device functions but the specifications might not be guaranteed. For

guaranteed specifications and test conditions see the Electrical Characteristics.

able power dissipation will cause excessive die temperature, and the regulator will go into thermal shut-

down.

Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as pos-

sible.

Note4: The type of output capacitor should be tantalum or aluminum.

Definitions

Dropout Voltage

The input/output Voltage differential at which the regu-

lator output no longer maintains regulation against

further reductions in input voltage. Measured when the

output drops 100mV below its nominal value, dropout

voltage is affected by junction temperature, load cur-

rent and minimum input supply requirements.

Line Regulation

The change in output voltage for a change in input

voltage. The measurement is made under conditions

of low dissipation or by using pulse techniques such

that average chip temperature is not significantly af-

fected.

Load Regulation

The change in output voltage for a change in load

current at constant chip temperature. The measure-

ment is made under conditions of low dissipation or by

using pulse techniques such that average chip tem-

perature is not significantly affected.

Maximum Power Dissipation

The maximum total device dissipation for which the

regulator will operate within specifications.

Quiescent Bias Current

Current which is used to operate the regulator chip

and is not delivered to the load.