D

E

A

A1

0.2 Z

0.2 Z

Z

b

e

Ironwood Package Code: BGA1169A

1. Dimensions are in millimeters.

2. Interpret dimensions and tolerances per ASME Y14.5M-1994.

3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.

4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.

5. Parallelism measurement shall exclude any effect of mark on top surface of package.

DIM

Minimum Maximum

A

-

2.4

A1

0.3

0.5

b

0.4

0.65

D

28.8

29.2

E

28.8

29.2

e

0.80 BSC

ARRAY

35 x 35

PIN COUNT

1169

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Compatible BGA

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 10/21/2014

Material: N/A

Finish: N/A

Weight: 43.35

SBT-BGA-6521 Drawing

SCALE: 2:1

SHEET: 3 OF 4

ENG: B. Schatz

FILE: SBT-BGA-6521 Dwg

DRAWN BY: M. Raske