1.70±0.10 (x4)

non-plated mounting hole

0.850±0.025 (x2)

non-plated alignment hole

2.540±0.025

5.080±0.025

5.00

17.725

Backing Plate Outline

15.225±0.125

Socket Base Outline

12.725±0.050 (x2)

*4.1125±0.025

3.8625±0.025

0.50 typ

0.280 (x120) BGA pads

16.075

Bottom Guide

15.400

Bottom Guide

*Note: BGA pattern is not symmetrical

with respect to the mounting holes. It is offset

0.25mm to the right of center with respect to the

mounting holes.

Target PCB Recommendations

Total thickness: 1.6mm min.

Plating: Gold or Solder finish

PCB Pad height: same or higher than solder mask

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all

other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommended PCB Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. B

DATE: 9/12/13

Material: Material <not specified>

Finish:

Weight: 10.27

SBT-BGA-7013 Drawing

SCALE: 6:1

SHEET: 2 OF 5

ENG: M.A. Fedde

FILE: SBT-BGA-7013 Dwg

DRAWN BY: M. Raske