2

IR2172

ADVANCE INFORMATION

www.irf.com

Symbol

Definition

Min.

Max.

Units

High side offset voltage

-0.3

600

High side floating supply voltage

-0.3

25

Low side and logic fixed supply voltage

-0.3

25

-5

5

Digital PWM output voltage

COM -0.3

VCC +0.3

Overcurrent output voltage

COM -0.3

VCC +0.3

dV/dt

Allowable offset voltage slew rate

—

50

V/ns

8 lead SOIC

—

.625

8 lead PDIP

—

1.0

16 lead SOIC

—

1.25

Thermal resistance, junction to ambient

8 lead SOIC

—

200

8 lead PDIP

—

125

16 lead SOIC

—

100

Junction temperature

—

150

Storage temperature

-55

150

Lead temperature (soldering, 10 seconds)

—

300

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage

parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal

resistance and power dissipation ratings are measured under board mounted and still air conditions.

V

°C/W

Recommended Operating Conditions

The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recom-

mended conditions.

W

pins.

Symbol

Definition

Min.

Max.

Units

High side floating supply voltage

High side floating supply offset voltage

note 2

600

Digital PWM output voltage

COM

VCC

Overcurrent output voltage

COM

VCC

Low side and logic fixed supply voltage

9.5

20

-260

+260

mV

Ambient temperature

-40

125

°C

V

°C