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LM4874MH датащи(PDF) 15 Page - National Semiconductor (TI) |
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LM4874MH датащи(HTML) 15 Page - National Semiconductor (TI) |
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15 / 21 page ![]() Application Information PCB LAYOUT AND SUPPLY REGULATION CONSIDERATIONS FOR DRIVING 3W AND 4W LOADS Power dissipated by a load is a function of the voltage swing across the load and the load’s impedance. As load imped- ance decreases, load dissipation becomes increasingly de- pendent on the interconnect (PCB trace and wire) resistance between the amplifier output pins and the load’s connec- tions. Residual trace resistance causes a voltage drop, which results in power dissipated in the trace and not in the load as desired. For example, 0.1 Ω trace resistance reduces the output power dissipated by a 4 Ω load from 2.1W to 2.0W. This problem of decreased load dissipation is exacerbated as load impedance decreases. Therefore, to maintain the highest load dissipation and widest output voltage swing, PCB traces that connect the output pins to a load must be as wide as possible. Poor power supply regulation also adversely affects maxi- mum output power. A poorly regulated supply’s output volt- age decreases with increasing load current. Reduced supply voltage causes decreased headroom, output signal clipping, and reduced output power. Even with tightly regulated sup- plies, trace resistance creates the same effects as poor supply regulation. Therefore, making the power supply traces as wide as possible helps maintain full output voltage swing. BRIDGE CONFIGURATION EXPLANATION As shown in Figure 1, each of the LM4874’s stereo channels consists of two operational amplifiers. The LM4874 can be used to drive a speaker connected between the two outputs of each channel’s amplifiers. Figure 1 shows that the output of Amp1 serves as the input to Amp2, which results in both amplifiers producing signals identical in magnitude, but 180˚ out of phase. Taking advan- tage of this phase difference, a load is placed between OUT+ and OUT- and driven differentially (commonly referred to as ’bridge mode’). This results in a differential gain of A VD = 2(RF/RI) (1) Bridge mode is different from single-ended amplifiers that drive loads connected between a single amplifier’s output and ground. For a given supply voltage, bridge mode has a distinct advantage over the single-ended configuration: its differential output doubles the voltage swing across the load. This results in four times the output power when compared to a single-ended amplifier under the same conditions. This increase in attainable output assumes that the amplifier is not current limited or the output signal is not clipped. To ensure minimum output signal clipping when selecting one of the amplifier’s four closed-loop gains, refer to the Audio Power Amplifier Design section. Another advantage of the differential bridge output is no net DC voltage across the load. This results from biasing OUT+ and OUT- at half-supply. This eliminates the coupling capaci- tor that single supply, single-ended amplifiers require. Elimi- nating an output coupling capacitor in a single-ended con- figuration forces a single supply amplifier’s half-supply bias voltage across the load. The current flow created by the half-supply bias voltage increases internal IC power dissipa- tion and may permanently damage loads such as speakers. POWER DISSIPATION Power dissipation is a major concern when designing a successful bridged or single-ended amplifier. Equation (2) states the maximum power dissipation point for a single- ended amplifier operating at a given supply voltage and driving a specified output load. P DMAX =(VDD) 2/(2 π2R L) Single-Ended (2) However, a direct consequence of the increased power de- livered to the load by a bridge amplifier is an increase in the internal power dissipation point for a bridge amplifier oper- ating at the same given conditions. P DMAX =4 * (VDD) 2/(2 π2R L) Bridge Mode (3) The LM4874 has four operational amplifiers in one package and the maximum internal power dissipation is four times that of a single-ended amplifier. From Equation (3), assum- ing a 5V power supply and an 8 Ω load, the maximum power dissipation point is 2W. The maximum power dissipation point obtained from Equation (3) must not exceed the power dissipation predicted by Equation (4): P DMAX =(TJMAX −TA)/ θ JA (4) For the exposed DAP TSSOP package, θ JA= 41˚C/W. T JAMAX = 150˚C for the LM4874. For a given ambient tem- perature T A, Equation (4) can be used to find the maximum internal power dissipation supported by the IC packaging. If the result of Equation (3) is greater than that of Equation (4), decrease the supply voltage, increase the load impedance, or reduce the ambient temperature. For a typical application with a 5V power supply and an 8 Ω load, the maximum ambient temperature that does not violate the maximum junction temperature is approximately 68˚C. This further as- sumes that a device is a surface mount part operating around the maximum power dissipation point. Since internal power dissipation is a function of output power, higher am- bient temperatures are allowed as output power decreases. Refer to the Typical Performance Characteristics curves for power dissipation information at lower output power levels. BTL GAIN SELECTION The LM4874 features four fixed, internally set, BTL voltage gains: 6dB, 10dB, 15.6dB, and 21.6dB. Select one of the four gains by applying a logic level signal to the GAIN0 (MSB) and GAIN1 (LSB) digital inputs. The closed-loop gain of the first amplifier is adjustable, hav- ing four different gains, whereas two internal 20k Ω resistors set the second amplifier’s gain at -1. Table 1 below, shows the state of the two logic inputs required to select one of the four gain values. www.national.com 15 |
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