LM4866 datasheet(4/21 Pages) NSC

4 / 21 page

Electrical Characteristics for Bridged-Mode Operation (Notes 3, 11) (Continued)

The following specifications apply for V

DD= 5V unless otherwise specified. Limits apply for TA= 25˚C.

Symbol

Parameter

Conditions

LM4866

Units

(Limits)

Typical

Limit

(Note 12)

(Note 13)

THD+N

Total Harmonic Distortion+Noise

20Hz

≤ f ≤ 20kHz, A

VD =2

LM4866MTE, R

L =4

Ω,P

O =2W

LM4866LQ, R

L =4

Ω,P

O =2W

LM4866MT, R

L =4

Ω,P

O =1W

0.3

LM4866MT, R

L =8

Ω,P

O = 1W

0.3

PSRR

Power Supply Rejection Ratio

DD = 5V, VRIPPLE = 200mVRMS,RL =8

Ω,

B = 1.0µF

TALK

Channel Separation

f = 1kHz, C

B = 1.0µF

SNR

Signal To Noise Ratio

DD = 5V, PO = 1.1W, RL =8

Ω

Note 3: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which

guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit

is given, however, the typical value is a good indication of device performance.

Note 4: The maximum power dissipation is dictated by TJMAX, θJA, and the ambient temperature TA and must be derated at elevated temperatures. The maximum

allowable power dissipation is PDMAX =(TJMAX −TA)/θJA. For the LM4866, TJMAX = 150˚C. For the θJAs for different packages, please see the Application

Information section or the Absolute Maximum Ratings section.

Note 5: Human body model, 100pF discharged through a 1.5k

Ω resistor.

Note 6: Machine model, 220pF–240pF discharged through all pins.

Note 7: The given

θJA is for an LM4866 packaged in an LQA24A with the exposed−DAP soldered to an exposed 2in2 area of 1oz printed circuit board copper.

Note 8: The given

θJA is for an LM4866 packaged in an MXA20A with the exposed−DAP soldered to an exposed 2in2 area of 1oz printed circuit board copper.

Note 9: The given

θJA is for an LM4866 packaged in an MXA20A with the exposed−DAP soldered to an exposed 1in2 area of 1oz printed circuit board copper.

Note 10: The given

θJA is for an LM4866 packaged in an MXA20A with the exposed−DAP not soldered to prinbted circuit board copper.

Note 11: All voltages are measured with respect to the ground (GND) pins unless otherwise specified.

Note 12: Typicals are measured at 25˚C and represent the parametric norm.

Note 13: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.

Note 14: The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.

Note 15: Output power is measured at the device terminals.

Note 16: When driving 3

Ω or 4Ω loads and operating on a 5V supply, the LM4866LQ and LM4866MTE must be mounted to a circuit board that has a minimum of

2.5in2 of exposed, uninterrupted copper area connected to the package’s exposed DAP.

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