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LM4753 датащи(PDF) 10 Page - National Semiconductor (TI) |
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LM4753 датащи(HTML) 10 Page - National Semiconductor (TI) |
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10 / 13 page ![]() Application Information (Continued) Line Out The line out function for the LM4753 is intended to provide preamp output control for signal routing to an external power amplifier. An example of this would be in a TV where the TV’s remote control provides volume control on the audio signals that may be sent to a home theater receiver. The line out am- plifier is only able to drive high impedance loads like 2 k Ω and 10 k Ω. Since the LM4753 utilizes a single +22V power supply, the output of the line out amplifier is biased at 1⁄2 of V CC or +11V. Because of this, its output should be capacitor coupled to any other processing IC. The value of the capaci- tor is chosen by using Equation (1). f = 1/2 πRC (1) where R is the processing IC input impedance and f is the lowest audio frequency to be passed, like 20 Hz. The value of capacitance is then calculated. For a 10 k Ω impedance, C = 1µF. AC Short Circuit Protection The LM4753 is AC short circuit protected with a current lim- iting setting minimum of 2.0A. Current limiting protection works on AC waveforms only. DC shorts from the output to ground are not protected. Generally this is not a concern as there is a DC blocking capacitor on the output to protect the speaker from single-supply DC bias. Thermal Shutdown Protection The LM4753 has a thermal shutdown protection scheme that limits the drive capability of each amplifier output when the internal die temperature reaches the temperature trip point of 150˚C. The limiting of the output current drive capability is proportional to increasing die temperature. When the IC is in thermal shutdown mode, all of the DC bi- ases of the IC remain unchanged. It is only the current drive capability of the output power transistors that is limited. This thermal shutdown mechanism provides for smooth audio at- tenuation rather than abruptly pulling the outputs to ground. When the outputs are being limited, the maximum voltage swing will be reduced, creating a clipping effect as shown in Figure 7. With further increases in die temperature the maxi- mum voltage swing will be further reduced. The thermal sensing mechanism monitors the global die temperature and is not intended to operate quickly enough to shutdown the IC for extremely high power dissipation pulses created by driving very low impedance loads. DS100043-30 FIGURE 6. Turn-On/Off External Circuitry Sequence www.national.com 10 |
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