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LIB1000 датащи(PDF) 9 Page - LUXPIA |
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LIB1000 датащи(HTML) 9 Page - LUXPIA |
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9 / 15 page ![]() (Ver 1.0) 8/14 9. Reliability 9.1. test items and results no. test item Test Conditions Note number of damaged sample 1 resistance to soldering heat (reflow) Tsld=260oC, 10sec 2 times 0/22 2 solderability (reflow) Tsld=215± 5oC, 3sec 1 time over 95% 0/22 3 temperature cycle -40oC through +25oC to +85℃ (30min/5min/30min) 100 cycles 0/22 4 high temperature storage Ta=85℃ 1000 hrs 0/22 5 high humidity and temperature storage Ta=60℃, RH=90% 1000 hrs 0/22 6 low temperature storage Ta=-30℃ 1000 hrs 0/22 7 steady-state operating lifetime test Ta=25℃, IF=10mA 500 hrs 0/22 8 steady-state operating lifetime of high humidity and temperature Ta=60℃, RH=90%, IF=5mA 500 hrs 0/22 9 steady-state operating lifetime of low temperature Ta=-30℃, IF=10mA 500 hrs 0/22 * Reliability is measure on the thermal emission PCB for LED Reliability test. 9.2. criteria for judging the damage item symbol test condition criteria for judgement min max forward voltage VF IF = 5mA - U.S.L.5) × 1.2 luminous intensity IV IF = 5mA L.S.L.6) × 0.5 - 5) U.S.L. : upper standard level 6) L.S.L. : lower standard level |
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