B264

DF19 Series

Manual soldering : 290±10ç for 3 seconds

0.15mm

Maximum of 0.03mm at the connector center, with both ends of the connector as

reference points.

Refer to “Wire-to-Board Connector Use Handbook.”

Refer to “Wire-to-Board Connector Use Handbook.”

Refer to “Wire-to-Board Connector Use Handbook.”

1. Recommendedtemperature profile

2. Manual soldering

3. Screen thickness

4. Board warpage

5. Cleaning conditions

6. Termination conditions

7. Cautions

8. Precautions

Note 1 : Up to 2 cycles of Reflow soldering are possible under the same

conditions, provided that there is a return to normal temperature

between the first and second cycle.

Note 2 : The temperature profile indicates the board surface temperature at

the point of contacts with the connector terminals.

Note 3 : The product can be used without trouble though the surface of a

grounding plate might discolor.

Temperature(ç)

250ç

200ç

150ç

100ç

50ç

60 to 120(S)

250ç

10(s)max

220ç min 60(s)max

Preheating

180

220

30

50

100

150

200

soldering

TIME(S)

B253-265　DF19 16.5.25 15:42 ページ B264