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A1

A0

1

2

3

4

5

6

7

8

10

9

GND

SDA

SCL

DAC7574

DAC7574

SLAS375 – JUNE 2003

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated

circuits be handled with appropriate precautions. Failure to observe proper handling and installation

procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION

PRODUCT

PACKAGE

PACKAGE

SPECIFICATION

PACKAGE

ORDERING

TRANSPORT MEDIA

DRAWING

TEMPERATURE

MARKING

NUMBER

NUMBER

RANGE

DAC7574

10-MSOP

DGS

-40

°C TO +105°C

D774

DAC7574IDGS

80 Piece Tube

DAC7574IDGSR

2500 Piece Tape and Reel

DGS PACKAGE

PIN DESCRIPTIONS

(TOPVIEW)

PIN

NAME

DESCRIPTION

1

Analog output voltage from DAC A

2

Analog output voltage from DAC B

Ground reference point for all circuitry on the

3

GND

part

4

Analog output voltage from DAC C

5

Analog output voltage from DAC D

6

SCL

Serial clock input

7

SDA

Serial data input and output

8

Analog voltage supply input

9

A0

10

A1

ABSOLUTE MAXIMUM RATINGS (1)

–0.3 V to +6 V

Digital input voltage to GND

Operating temperature range

– 40

°C to +105°C

Storage temperature range

– 65

°C to +150°C

+150

°C

Power dissipation:

Thermal impedance (

ΘJA)

270

°C/W

Thermal impedance (

ΘJC)

77

°C/W

Lead temperature, soldering:

Vapor phase (60s)

215

°C

Infrared (15s)

220

°C

(1)

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute

maximum conditions for extended periods may affect device reliability.

2