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MIC5200 датащи(PDF) 13 Page - Microchip Technology

номер детали MIC5200
подробное описание детали  100 mA Low-Dropout Regulator
PDF  24 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MIC5200 датащи(HTML) 13 Page - Microchip Technology

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 2016 Microchip Technology Inc.
DS20005578A-page 13
MIC5200
5.0
THERMAL CONSIDERATIONS
5.1
Layout
The MIC5200-x.xYM (8-pin surface mount package)
has the following thermal characteristics when
mounted on a single-layer copper-clad printed circuit
board.
Multi-layer boards having a ground plane, wide traces
near the pads, and large supply bus lines provide better
thermal conductivity.
The "worst case" value of 160 °C/W assumes no
ground plane, minimum trace widths, and a FR4
material board.
5.2
Nominal Power Dissipation and
Die Temperature
The MIC5200-x.xYM at a 25°C ambient temperature
will operate reliably at up to 625 mW power dissipation
when mounted in the "worst case" manner described
above. At an ambient temperature of 55°C, the device
may safely dissipate 440 mW. These power levels are
equivalent to a die temperature of 125°C, the
recommended maximum temperature for non-military
grade silicon integrated circuits.
For MIC5200-x.xYS (SOT-223 package) heat sink
characteristics, please refer to Application Hint 17,
“Calculating P.C. Board Heat Sink Area for Surface
Mount Packages”.
PC Board Dielectric
JA
FR4
160 °C/W
Ceramic
120 °C/W



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