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MIC5202 датащи(PDF) 13 Page - Microchip Technology |
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MIC5202 датащи(HTML) 13 Page - Microchip Technology |
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13 / 22 page ![]() 2016 Microchip Technology Inc. DS20005614A-page 13 MIC5202 5.0 THERMAL CONSIDERATIONS 5.1 Layout The MIC5202 (8-pin SOIC package) has the thermal characteristics shown in Table 5-1, when mounted on a single-layer copper-clad printed circuit board. Multi-layer boards with a dedicated ground plane, wide traces, and large supply bus lines provide better thermal conductivity. The “worst case” value of 160°C/W assumes no ground plane, minimum trace widths, and a FR4 material board. 5.2 Nominal Power Dissipation and Die Temperature At +25°C ambient temperature, the MIC5202 operates reliably at up to 625 mW when mounted in the “worst case” manner described in the previous section. At an ambient temperature of +55°C, the device can safely dissipate 440 mW. These power levels are equivalent to a die temperature of +125°C, which corresponds to the recommended maximum temperature for non-military grade silicon integrated circuits. TABLE 5-1: THERMAL CHARACTERISTIC CONSIDERATIONS PC Board Dielectric θJA FR4 160°C/W Ceramic 120°C/W |
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