2

2 - 24

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Outline Drawing

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS .004”

3. TYPICAL BOND IS .004” SQUARE

4. BACKSIDE METALLIZATION: GOLD

5. BOND PAD METALLIZATION: GOLD

6. BACKSIDE METAL IS GROUND.

7. CONNECTION NOT REQUIRED FOR

UNLABELED BOND PADS.

Standard

Alternate

GP-5 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

Pad Description

HMC331

v04.1007

GaAs MMIC PASSIVE FREQUENCY

DOUBLER, 12 - 18 GHz INPUT

Pad Number

Function

Description

Interface Schematic

1

RFIN

DC coupled and matched to 50 Ohm.

2

RFOUT

DC coupled and matched to 50 Ohm.

Die Bottom

GND

Die bottom must be connected to RF/DC ground.