| поискавой системы для электроныых деталей |
|
FFP20S65S датащи(PDF) 2 Page - Micross Components |
|
|
|||||||||||||||||||||||||||||
FFP20S65S датащи(HTML) 2 Page - Micross Components |
|
2 / 3 page ![]() Further Information - Contact your Micross sales office or email your enquiry to baredie@micross.com Part Number Format Detail / Drawing FFP20S65SMW Un-sawn wafer, electrical rejects inked Page 2 FFP20S65SMF Sawn wafer on film-frame Page 3 FFP20S65SMD Singulated die / chips in waffle pack Page 3 Note: Singulated Die / Chips can also be supplied in Pocket Tape or SurfTape® on request Parameter Units Chip Dimensions Un-sawn 1900 x 4060 µm Chip Thickness (Nominal) 250 µm Anode Pad Size 949.2 x 3109 µm Wafer Diameter 127mm (subject to change) mm Saw Street 80 (subject to change) µm Wafer orientation on frame Wafer notch parallel with frame flat Topside Metallisation & Thickness Al 6 µm Backside Metallisation & Thickness V/Ni/Ag 0.3 µm Topside Passivation Silicon Nitride Recommended Die Attach Material Soft Solder or Conductive Epoxy Recommended Wire Bond - Anode Al 380µm X2 Ordering Guide Die Drawing - Dimensions in µm Mechanical Data 949.2 4060 1900 40 ANODE Passivated area Chip backside is CATHODE ©2014 Fairchild Semiconductor Corporation & Micross Components |
|
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |