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HV7350 датащи(PDF) 9 Page - Microchip Technology |
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HV7350 датащи(HTML) 9 Page - Microchip Technology |
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9 / 16 page ![]() 2016 Microchip Technology Inc. DS20005627A-page 9 HV7350 3.0 FUNCTIONAL DESCRIPTION Follow the steps below to power up and power down the HV7350: POWER-UP AND POWER-DOWN SEQUENCE (Note 1) Power-Up Power-Down Step Description Step Description 1 VLL with logic signal low 1 All logic signals go to low 2 VDD 2 VPP and VNN 3 REN = 1 (external supplies on) 3 REN = 0 (external supplies off) 4 VPP and VNN 4 VDD 5 Logic control signals active 5 VLL Note 1: Powering up or down in any arbitrary sequence will not damage the device. The power-up sequence and power-down sequence are only recommended to minimize possible inrush current. OUTPUT CURRENT AND RON (Note 1, Note 4) ISC 2 RonP RonN IDMP 3 RonDP RonDN 1.5A 13Ω 6.5Ω 1.5A 13Ω 8Ω Note 1: VPP/VNN = +/-60V; VDD = +3.3V; REN = 1 2: ISC is current into 1Ω to GND. 3: IDMP is current from +/–30V connected to TX pin. 4: Maximum pulse width for current measurement on TX pin is 20 ns. |
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