Data Sheet

10

Rev. 1.2, 2015-01-15

TLS205B0

General Product Characteristics

Junction to Ambient

R

thJA

–

69

–

K/W

area on PCB 3)

P_4.3.9

Junction to Ambient

R

thJA

–

57

–

K/W

area on PCB 3)

P_4.3.10

1) Not subject to production test, specified by design.

2) Specified

R

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 µm Cu, 2 x 35 µm Cu).

Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

3) Specified

R

Table 3

Parameter

Symbol

Values

Unit

Note /

Test Condition

Number

Min.

Typ.

Max.