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IXDD404PI датащи(PDF) 3 Page - IXYS Corporation

номер детали IXDD404PI
подробное описание детали  4 Amp Dual Low-Side Ultrafast MOSFET Driver
PDF  10 Pages
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производитель  IXYS [IXYS Corporation]
домашняя страница  http://www.ixys.com
Logo IXYS - IXYS Corporation

IXDD404PI датащи(HTML) 3 Page - IXYS Corporation

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PRELIMINARY DATA SHEET
IXDD404PI/404SI/404SIA/404SI-16
Pin Description
SYMBOL
FUNCTION
DESCRIPTION
EN A
A Channel Enable
The Channel A enable pin. This pin, when driven low, disables the A
Channel, forcing a high impedance state to the A Channel Output.
IN A
A Channel Input
A Channel Input signal-TTL or CMOS compatible.
GND
Ground
The system ground pin. Internally connected to all circuitry, this pin provides
ground reference for the entire chip. This pin should be connected to a low
noise analog ground plane for optimum performance.
IN B
B Channel Input
B Channel Input signal-TTL or CMOS compatible.
OUT B
B Channel Output
B Channel Driver output. For application purposes, this pin is connected,
through a resistor, to Gate of a MOSFET/IGBT.
VCC
Supply Voltage
Positive power-supply voltage input. This pin provides power to the entire
chip. The range for this voltage is from 4.5V to 25V.
OUT A
A Channel Output
A Channel Driver output. For application purposes, this pin is connected,
through a resistor, to Gate of a MOSFET/IGBT.
EN B
B Channel Enable
The Channel B enable pin. This pin, when driven low, disables the B
Channel, forcing a high impedance state to the B Channel Output.
Figure 2 - Characteristics Test Diagram
Note 1: Operating the device beyond parameters with listed “absolute maximum ratings” may cause permanent
damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not
guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when
handling and assembling this component.
VIN
EN A
IN A
GND
IN B
EN B
OUT A
OUT B
VCC
1
2
3
4
8
7
6
5
I
X
D
D
4
0
4
SO8 (SI, SIA)
8 PIN DIP (PI)
SO16 (SI-16)
Pin Configurations



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