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STM32F091CB датащи(PDF) 118 Page - STMicroelectronics |
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STM32F091CB датащи(HTML) 118 Page - STMicroelectronics |
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118 / 127 page ![]() Package information STM32F091xB STM32F091xC 118/127 DocID026284 Rev 3 7.7 UFQFPN48 package information UFQFPN48 is a 48-lead, 7x7 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package. Figure 51. UFQFPN48 package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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