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STM32F071C8 датащи(PDF) 51 Page - STMicroelectronics |
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STM32F071C8 датащи(HTML) 51 Page - STMicroelectronics |
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51 / 122 page ![]() DocID025451 Rev 5 51/122 STM32F071x8 STM32F071xB Electrical characteristics 96 6.3 Operating conditions 6.3.1 General operating conditions 6.3.2 Operating conditions at power-up / power-down The parameters given in Table 25 are derived from tests performed under the ambient temperature condition summarized in Table 24. Table 24. General operating conditions Symbol Parameter Conditions Min Max Unit fHCLK Internal AHB clock frequency - 0 48 MHz fPCLK Internal APB clock frequency - 0 48 VDD Standard operating voltage - 2.0 3.6 V VDDIO2 I/O supply voltage Must not be supplied if VDD is not present 1.65 3.6 V VDDA Analog operating voltage (ADC and DAC not used) Must have a potential equal to or higher than VDD VDD 3.6 V Analog operating voltage (ADC and DAC used) 2.4 3.6 VBAT Backup operating voltage - 1.65 3.6 V VIN I/O input voltage TC and RST I/O –0.3 VDDIOx+0.3 V TTa I/O –0.3 VDDA+0.3(1) FT and FTf I/O –0.3 5.5(1) BOOT0 0 5.5 PD Power dissipation at TA = 85 °C for suffix 6 or TA = 105 °C for suffix 7(2) UFBGA100 - 364 mW LQFP100 - 476 LQFP64 - 455 LQFP48 - 370 UFQFPN48 - 625 WLCSP49 - 408 TA Ambient temperature for the suffix 6 version Maximum power dissipation –40 85 °C Low power dissipation(3) –40 105 Ambient temperature for the suffix 7 version Maximum power dissipation –40 105 °C Low power dissipation(3) –40 125 TJ Junction temperature range Suffix 6 version –40 105 °C Suffix 7 version –40 125 1. For operation with a voltage higher than VDDIOx + 0.3 V, the internal pull-up resistor must be disabled. 2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax. See Section 7.7: Thermal characteristics. 3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.7: Thermal characteristics). |
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