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IPL60R385CP датащи(PDF) 4 Page - Infineon Technologies AG |
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IPL60R385CP датащи(HTML) 4 Page - Infineon Technologies AG |
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4 / 13 page ![]() 600V CoolMOS™ CP Power Transistor IPL60R385CP Maximum ratings Final Data Sheet 4 Rev. 2.1, 2012-01-10 2 Maximum ratings at T j = 25 °C, unless otherwise specified. 3 Thermal characteristics Table 2 Maximum ratings Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Continuous drain current 1) 1) Limited by T j,max. Maximum duty cycle I D -- 9.0 A T C= 25 °C 5.7 T C= 100°C Pulsed drain current 2) 2) Pulse width t p limited by Tj,max I D,pulse -- 27 A T C=25 °C Avalanche energy, single pulse E AS -- 227 mJ I D=3.4 A,VDD=50 V (see table 17) Avalanche energy, repetitive 2)3) 3) Repetitive avalanche causes additional power losses that can be calculated as PAV=EAR*f. E AR - - 0.34 I D=3.4 A,VDD=50 V Avalanche current, repetitive 2)3) I AR -- 3.4 A MOSFET dv/dt ruggedness dv/dt - - 50 V/ns V DS=0...480 V Gate source voltage V GS -20 - 20 V static -30 30 AC (f>1 Hz) Power dissipation P tot -- 83 W T C=25 °C Operating temperature T j -40 - 150 °C Storage temperature T stg -40 - 125 °C Continuous diode forward current I S -- 9.0 A T C=25 °C Diode pulse current 2) I S,pulse -- 27 A T C=25 °C Reverse diode dv/dt 4) 4) Identical low side and high side switch with identical R G dv/dt - - 15 V/ns V DS=0...400 V, ISD ≤ ID, T j=25 °C Maximum diode commutation speed 4) di f/dt - - 400 A/µs (see table 18) Table 3 Thermal characteristics Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Thermal resistance, junction - case R thJC -- 1.5 °C/W Thermal resistance, junction - ambient R thJA - - 45 SMD version, device on PCB, 6cm 2 cooling area 1) 1) Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm 2 copper area (thickness 70µm) for drain connection. PCB is vertical without air stream cooling. Reflow soldering temperature T sold - - 260 °C reflow MSL 3 |
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