ADCMP380

Data Sheet

Rev. 0 | Page 10 of 10

OUTLINE DIMENSIONS

Figure 17. 6-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-6-17)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Branding

ADCMP380-1ACBZ-RL7

−40°C to +85°C

6-Ball Wafer Level Chip Scale Package [WLCSP]

CB-6-17

CW

ADCMP380-2ACBZ-RL7

−40°C to +85°C

6-Ball Wafer Level Chip Scale Package [WLCSP]

CB-6-17

LQZ

A

B

C

0.660

0.600

0.540

0.390

0.360

0.330

0.270

0.240

0.210

1.000

0.960

0.920

1.500

1.460

1.420

1

2

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

SIDE VIEW

0.360

0.320

0.280

1.00

REF

0.50

BSC

BALL A1

IDENTIFIER

SEATING

PLANE

0.50 BSC

COPLANARITY

0.04

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registered trademarks are the property of their respective owners.

D12783-0-3/15(0)