TSS461CVAN datasheet(2/24 Pages) TEMIC

2 / 24 page

Qualpack TS80C31X2/C32X2

Rev. 2 – January 1999

1. Contents

1. Contents........................................................................................................................................................ 2

2. General Information ..................................................................................................................................... 3

3. Technology Information .............................................................................................................................. 4

3.1 WAFER PROCESS TECHNOLOGY ..................................................................................................................... 4

3.2 PRODUCT DESIGN .......................................................................................................................................... 5

3.3 PACKAGE TECHNOLOGY ................................................................................................................................. 6

3.3.1 SOIC.300 16 leads............................................................................................................................... 6

3.3.2 Other available packages .................................................................................................................... 7

3.4 TEST ............................................................................................................................................................. 7

3.5 DEVICE CROSS SECTION ................................................................................................................................8

3.6 WAFER PROCESS CONTROL ........................................................................................................................... 9

4. Qualification ............................................................................................................................................... 10

4.1 CHANGE PROCEDURE................................................................................................................................... 11

4.2 QUALIFICATION FLOW ................................................................................................................................... 12

4.3 WAFER PROCESS QUALIFICATION ................................................................................................................. 13

4.4 PACKAGE QUALIFICATION ............................................................................................................................. 14

4.5 DEVICE QUALIFICATION ................................................................................................................................16

4.5.1 ESD and Latch-up results .................................................................................................................. 17

4.5.2 Failure Mechanisms and Corrective Actions ..................................................................................... 17

4.5.3 Qualification status............................................................................................................................. 17

4.6 OUTGOING QUALITY AND RELIABILITY............................................................................................................ 18

4.6.1 AOQ (Average Outgoing Quality) ...................................................................................................... 18

4.6.2 EFR (Early Failure Rate).................................................................................................................... 19

4.6.3 LFR (Latent Failure Rate) .................................................................................................................. 19

5. User Information ........................................................................................................................................ 20

5.1 SOLDERING RECOMMENDATIONS .................................................................................................................. 20

5.2 DRY PACK ORDERING RULES ..................................................................................................................... 20

5.3 ESD CAUTION.............................................................................................................................................. 20

6. Environmental Information ....................................................................................................................... 21

7. Other Data................................................................................................................................................... 22

7.1 ISO9001 APPROVAL CERTIFICATE................................................................................................................ 22

7.2 DATABOOK REFERENCE................................................................................................................................23

7.3 ADDRESS REFERENCE.................................................................................................................................. 23

8. Revision History......................................................................................................................................... 24

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