LAYOUT RECOMMENDATIONS

A good board layout of the LM2750 circuit is required to

achieve optimal assembly, electical, and thermal dissipation

perfromance. Figure 4 is an example of a board layout

implementing recommended techniques. For more informa-

tion related to layout for the LLP package, refer to National

Semiconductor’s Application Note 1187: Leadless Lead-

frame Package (LLP). Below are some general guidelines

for board layout:

•

Place capacitors as close to the as possible to the

LM2750, and on the same side of the board. V

V

the LM2750 pads directly to these capacitor pads.

•

Connect the ground pins of the LM2750 and the capaci-

tors to a good ground plane. The ground plane is essen-

tial for both electrical and thermal disspation perfor-

mance.

•

For optimal thermal performance, make the ground

plane(s) as large as possible. Connect the die-attach pad

(DAP) of the LM2750 to the ground plane(s) with wide

traces and/or multiple vias. Top-layer ground planes are

most effective in increasing the thermal dissipation capa-

bility of the LLP package. Large internal ground planes

are also very effective in keeping the die temperature of

the LM2750 within operating ratings.

20035110

FIGURE 3. LM2750 Model for Power Efficiency and

Power Dissipation Calculations

20035126

FIGURE 4. LM2750-5.0 Recommended Layout

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