MAXM17505 datasheet(2/19 Pages) MAXIM

2 / 19 page

IN to PGND (Note 2) .............................................-0.3V to +65V

EN to SGND (Note 2)............................................-0.3V to +65V

VCC.............................................-0.3V to min (VIN + 0.3V, 6.5V)

FB, RESET, SS, CF, MODE,

SYNC, RT to SGND .........................................-0.3V to +6.5V

OUT to PGND (VIN < 25V).........................-0.3V to (VIN + 0.3V)

OUT to PGND (VIN ≥ 25V)....................................-0.3V to +25V

LX to PGND................................................-0.3V to (VIN + 0.3V)

BST to PGND........................................................-0.3V to +70V

BST to VCC ...........................................................-0.3V to +65V

BST to LX.............................................................-0.3V to +6.5V

Operating Temperature Range......................... -40°C to +125°C

Junction Temperature......................................................+125°C

Storage Temperature Range............................ -65°C to +125°C

Lead Temperature (soldering, 10s) .................................+245°C

Junction-to-Ambient Thermal Resistance (θJA) ...........25.2°C/W

Junction-to-Top-Case Thermal Resistance (YJT) ..........5.2°C/W

Electrical Characteristics

(VIN = VEN = 24V, RRT = 40.2kΩ (500kHz) to SGND, VPGND = VMODE = VSYNC = VSGND = 0V, VCC = LX = SS = RESET = OUT = open,

VBST to VLX = 5V, VFB = 1V, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C. All voltages are

referenced to SGND, unless otherwise noted.) (Note 4)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

INPUT SUPPLY (VIN)

IN Input Voltage Range

VIN

4.5

Input Shutdown Current

IIN_SH

VEN = 0V

10.5

μA

Input Quiescent Current

IQ_PFM_HIB MODE = RT = open

125

μA

IQ_DCM

MODE = VCC

1.16

1.8

IQ_PWM

Normal switching mode, no load

9.5

LOGIC INPUTS

EN Threshold

VENR

VEN rising

1.192

1.215

1.26

VENF

VEN falling

1.068

1.09

1.131

Enable Pullup Resistor

RENP

Pullup resistor between IN and EN pins

3.15

3.3

3.45

MΩ

LDO

VCC Output Voltage Range

VCC

6V < VIN < 60V, 1mA < IVCC < 25mA

4.75

5.25

VCC Current Limit

IVCC_MAX VIN = 6V, VCC = 4.3V

26.5

100

VCC Dropout

VCC_DO VIN = 4.5V, IVCC = 20mA

4.2

VCC UVLO

VCC_UVR VCC rising

4.05

4.2

4.3

VCC_UVF VCC falling

3.65

3.8

3.9

OUTPUT SPECIFICATIONS

Line Regulation Accuracy

VIN = 6.5V to 60V, VOUT = 5V

0.1

mV/V

Load Regulation Accuracy

Tested with IOUT = 0A and 1A

mV/A

MAXM17505

4.5V to 60V, 1.7A High-Efficiency, DC-DC Step-

Down Power Module with Integrated Inductor

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: SGND and PGND are internally connected.

Note 2: See Pin Description for the connection of the backside exposed pad.

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings (Notes 1, 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics (Note 3)

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