LM2698 datasheet(5/17 Pages) NSC

5 / 17 page

Electrical Characteristics (Continued)

Specifications in standard type face are for T

J = 25˚C and those with boldface type apply over the full Operating Tempera-

ture Range (T

J = −40˚C to +125˚C)Unless otherwise specified. VIN =2.2V and IL = 0A, unless otherwise specified.

Symbol

Parameter

Conditions

Min

(Note 6)

Typ

(Note 7)

Max

(Note 6)

Units

Thermal Resistance

Junction to Ambient

(Note 10)

235

˚C/W

Junction to Ambient

(Note 11)

225

Junction to Ambient

(Note 12)

220

Junction to Ambient

(Note 13)

200

Junction to Ambient

(Note 14)

195

Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to

be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 2: Shutdown and voltage frequency select should not exceed VIN.

Note 3: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA,

and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance of various layouts. The maximum allowable power dissipation

at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) −TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die

temperature, and the regulator will go into thermal shutdown.

Note 4: The human body model is a 100 pF capacitor discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF capacitor discharged

directly into each pin.

Note 5: ESD susceptibility using the human body model is 500V for VC.

Note 6: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100% tested

or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods.

All limits are used to calculate Average Outgoing Quality Level (AOQL).

Note 7: Typical numbers are at 25˚C and represent the most likely norm.

Note 8: This is the switch current limit at 0% duty cycle. The switch current limit will change as a function of duty cycle. See Typical performance Characteristics

section for ICL vs. VIN

Note 9: Bias current flows into FB pin.

Note 10: Junction to ambient thermal resistance (no external heat sink) for the MSO8 package with minimal trace widths (0.010 inches) from the pins to the circuit.

See ’Scenario ’A’’ in the Power Dissipation section.

Note 11: Junction to ambient thermal resistance for the MSO8 package with minimal trace widths (0.010 inches) from the pins to the circuit and approximately

0.0191 sq. in. of copper heat sinking. See ’Scenario ’B’’ in the Power Dissipation section.

Note 12: Junction to ambient thermal resistance for the MSO8 package with minimal trace widths (0.010 inches) from the pins to the circuit and approximately

0.0465 sq. in. of copper heat sinking. See ’Scenario ’C’’ in the Power Dissipation section.

Note 13: Junction to ambient thermal resistance for the MSO8 package with minimal trace widths (0.010 inches) from the pins to the circuit and approximately

0.2523 sq. in. of copper heat sinking. See ’Scenario ’D’’ in the Power Dissipation section.

Note 14: Junction to ambient thermal resistance for the MSO8 package with minimal trace widths (0.010 inches) from the pins to the circuit and approximately

0.0098 sq. in. of copper heat sinking on the top layer and 0.0760 sq. in. of copper heat sinking on the bottom layer, with three 0.020 in. vias connecting the planes.

See ’Scenario ’E’’ in the Power Dissipation section.

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