BCF030T

Wire Bonding Options

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Gold Bonding Wire information

1. Gate to input transmission line

- Length and Height : 400 um and 250 um

- Number of wires: 1

2. Drain to output transmission line

- Length and Height : 350 um and 250 um

- Number of wires: 1

3. Source to ground plate

- Length and Height : 200 um x 250 um

- Number of wires: 4

Note:

The diameter of bonding wires: 1 mil

DIE ATTACH RECOMMENDATIONS:

BeRex recommends the “Eutectic” die attach using Au-Sn (80%-20%) pre-forms. The die attach station must have

accurate temperature control, and the operation should be performed with parts no hotter than 300°C for less

HANDLING PRECAUTIONS:

GaAs FETs are very sensitive to and may be damaged by Electrostatic Discharge (ESD). Therefore, proper ESD

precautions must be taken whenever you are handling these devices. It is critically important that all work

surfaces, and assembly equipment, as well as the operator be properly grounded when handling these devices to

prevent ESD damage.

STORAGE & SHIPPING:

BeRex’s standard chip device shipping package consists of an antistatic “Gel-Pak”, holding the chips, placed inside a

sealed antistatic and moisture barrier bag. This packaging is designed to provide a reasonable measure of

protection from both mechanical and ESD damage.

Chip devices should be stored in a clean, dry Nitrogen gas environment at room temperature until they are

required for assembly. Only open the shipping package or perform die assembly in a work area with a class 10,000

or better clean room environment to prevent contamination of the exposed devices.

www.berex.com

BeRex, Inc. 3350 Scott Blvd. #61-01 Santa Clara, CA 95054 tel. (408) 452-5595

January 2015

Specifications are subject to change without notice. ©BeRex 2015

Rev. 1.3